Description

Fehonda Liquid Thermal Pad (Thermal Putty) 12g 16.0W/m.k

High-Performance Thermal Putty

Get superior cooling performance with Fehonda Liquid Thermal Pad, designed for efficient heat transfer with 16.0W/m·K thermal conductivity. This liquid thermal putty enhances heat dissipation for CPUs, GPUs, power modules, and other components, ensuring stable operation and lower temperatures. Whether you’re an overclocking enthusiast or a professional looking for reliable cooling, this thermal putty delivers outstanding performance in various applications.

Exceptional Thermal Performance

With its high thermal conductivity, this thermal putty efficiently transfers heat away from components, preventing overheating and improving overall performance. Unlike traditional thermal pastes, it does not dry out over time, ensuring long-lasting effectiveness. By eliminating air gaps between surfaces, it maximizes heat dissipation, keeping components cooler under heavy workloads and intense gaming sessions.

Easy Application

The liquid form ensures easy spreading and fills micro gaps between surfaces, providing maximum contact for enhanced thermal efficiency. No additional pressure is required for application, making it an ideal choice for both beginners and professionals. The putty remains flexible and does not harden, allowing for easier reapplications and adjustments whenever needed.

Durability and Reliability

Unlike conventional thermal grease, Fehonda Liquid Thermal Pad maintains its consistency over time, resisting degradation and ensuring consistent performance for extended periods. It is resistant to drying, cracking, or thermal degradation, making it a long-term solution for your cooling needs. Whether used in extreme temperature environments or regular workloads, it delivers stable thermal performance.

Wide Compatibility

Compatible with a variety of processors, graphics cards, power units, and electronic chips, making it a versatile cooling solution for different applications. It works effectively in gaming setups, workstations, laptops, and even industrial electronic systems where effective heat management is crucial. Its non-conductive and non-corrosive properties ensure safety when used with delicate components.

Key Features of Fehonda Liquid Thermal Pad:

• 16.0W/m·K high thermal conductivity for superior heat dissipation.
• Liquid-based thermal putty for easy and effective application.
• Fills gaps and micro spaces for maximum heat transfer.
• Compatible with multiple electronic components, including CPUs and GPUs.
• Non-conductive and non-corrosive to ensure component safety.
• Long-lasting durability without drying or cracking over time.
• Flexible application for various cooling setups.
• Enhances system stability by keeping temperatures in check.

Enhance your cooling efficiency with Fehonda Liquid Thermal Pad, the ideal solution for high-performance thermal management. Whether you’re aiming for peak performance in gaming or looking for a reliable cooling solution for professional workloads, this thermal putty ensures optimal heat dissipation and long-term efficiency.

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