Maximize heat dissipation on your VRAM and VRMs with the Fehonda Liquid Thermal Pad (Thermal Putty). Boasting an ultra-high 18.0 W/m.K thermal conductivity, this 12g viscous putty easily conforms to any gap size, ensuring perfect component contact without the hassle of measuring traditional solid thermal pads. Ideal for high-end GPUs, gaming laptops, and consoles.
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Description
Push your hardware’s cooling capabilities to the absolute limit with the Fehonda High-Performance Liquid Thermal Pad (Thermal Putty). Designed for PC enthusiasts, extreme overclockers, and professional repair technicians, this premium thermal interface material replaces traditional, rigid thermal pads with a highly adaptable, viscous compound.
Featuring an exceptional thermal conductivity rating of 18.0 W/m.K, it rapidly transfers heat away from critical surface-mount components like GPU memory (VRAM), Voltage Regulator Modules (VRMs), and MOSFETs. Unlike standard solid pads, this thermal putty perfectly molds to any microscopic imperfection and bridges uneven gaps, guaranteeing 100% surface contact without exerting dangerous mounting pressure on your delicate electronics.
Key Features & Benefits:
Ultra-High Thermal Conductivity: 18.0 W/m.K ensures elite-level heat dissipation, significantly lowering operating temperatures and preventing thermal throttling on high-end graphics cards and laptops.
Universal Gap Filler: Completely eliminates the need to measure, cut, or stack traditional thermal pads. It smoothly compresses to the exact thickness required (from 0.1mm up to several millimeters).
Safe & Non-Conductive: 100% electrically non-conductive and non-capacitive, ensuring total safety for your motherboard and surrounding micro-components.
No Pump-Out Effect: Formulated to maintain its shape and viscosity over long periods, preventing the degradation commonly seen in standard thermal pastes and lower-quality pads.
12g Value Size: Provides enough thermal putty for multiple GPU repasting jobs or extensive motherboard VRM coverage.
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